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Dr. Wille specializes in the failure analysis of microelectronics, with experience in OLED display panels, camera/IR detector modules, ICs, ink , adhesives, housings and encasements, epoxy over-molding, conductive adhesives and solder. Her background in both semiconductor materials design and synthesis and systems and test engineering contribute to her expertise in determining failure root cause and functional solutions to problems in complex systems. She is an expert in developing novel methods for accessing and visualizing interfaces or layers that present a challenge for current techniques due to depth, material or process, which allows for unique insight or analysis along problem regions. 

Dr. Wille has experience as a systems and test engineer at a small semiconductor fab. As testing lab lead for a large program, she led and participated in a variety of failure analysis efforts, from wafer-level defects to integration issues. The size of this fab allowed for her to work closely with process, R&D and quality teams on production blockers, returns and reworks in addition to managing normal production flow through the test lab. Her experience also includes test software, specification and process reviews, creating clear work or software documentation and laboratory standard operating procedures for technicians on the line.

Dr. Wille's graduate work involved the design, solid-state synthesis, spark-plasma sintering and characterization of p-type semiconductor thermoelectric and magnetic materials. Her graduate characterization experience included SEM, EDS/WDS, XRD, electrical resistivity, Seebeck and Hall measurements, magnetic susceptibility, thermal diffusivity, thermal gravimetry (TG) and DSC. Her undergraduate work involved air-free synthesis and characterization of lead chalcogenide quantum dots and fabrication of MOSFETs via dipcoat and ALD for photovoltaic applications. Her undergraduate characterization work included FTIR, UV-Vis spectroscopy, TEM, Hall and I-V curve measurements.